3D IC
Siemens Digital Industries Software
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Three-dimensional integrated circuits take less space and deliver higher performance.
Episode results
3D IC
Jul 12, 2022
3D IC Integration Challenges
A common challenge faced when actualizing new technologies such as 3D IC is the lack of specialized tools to mass assemble them. That’s because their designs are normally developed by R&D teams that view commercialization as someone else’s task. At the moment, organizations are working to create and perfect the tools need to assemble 3D IC chips.
Today, John McMillan interviews John Ferguson, Director of Product Management, Dusan Petranovic, Principal Technologist, and Steve McKinney, Account Technology Manager. They’ll help us understand what a 3D IC verification workflow might look like.
In this episode, you’ll learn about the challenges associated with 3D IC integration and the components required to make it possible. You’ll also learn about the upgrades that have to be made to make 3D IC assembly possible. Additionally, you’ll hear about parasitic extraction and the tools available to execute it.
What You Will Learn In This Episode:
Challenges faced in the manufacture of 3D IC chips (02:01)
How to ensure that a 3D IC assembly line is aligned (04:18)
The challenges of integrating 3D IC (10:55)
The tools needed to make 3D IC integration possible (13:56)
Connect with Dusan Petranovic:
LinkedIn
Connect with Steve McKinney:
LinkedIn
Connect with John McMillan:
LinkedIn
Hosted on Acast. See acast.com/privacy for more information.
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3D IC
Feb 13, 2023
Uncovering 2.5D and 3D IC Tests
One of the best ways to speed-up product development is to integrate test as early as possible in the design cycle. This shift-left strategy becomes even more critical when advanced IC designs evolve from a single die per package to complex systems with multiple dies integrated into a package. These 2.5D and 3D multi-die design strategies pose some interesting challenges and opportunities for test.
Today, David Lyell interviews Joe Reynick, the Tessent Product Engineering Manager for Siemens EDA. He’ll help us to understand the complexity of development tests for 3D and 2.5D packages.
In this episode, you’ll learn about the challenges of performing comprehensive tests on 3D and 2.5D designs. You’ll also hear about the factors that you need to consider while planning for 3D DFT and IP tests. Additionally, you’ll hear about how 2.5D tests and 3D tests can complement each other.
What You Will Learn In This Episode:
The things you need to be aware of when doing 2.5D and 3D tests (03:34)
The DFT and IP test methods that the DFT and IP test team should implement (09:36)
The die and package level planning interactions needed for 3D DFT and IP test (11:22)
Factors to consider while doing 3D tests (14:20)
What is involved in multi-die IP core test (16:00)
Connect with Joe Reynick:
LinkedIn
Connect with David Lyell:
LinkedIn
Hosted on Acast. See acast.com/privacy for more information.
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3D IC
Nov 8, 2022
Getting Started with 3D IC
3D IC designs are complex puzzles that engineers have to solve to achieve high performance and reliability. While vertical stacking gives more design options, it also increases the possible number of defective arrangements. There is no one-design-fits-all in 3D IC; engineers must understand their needs and create designs that meet them.
Today, John McMillan interviews John Ferguson, Product Management Director of Calibre DRC Technologies at Siemens Digital EDA. He’ll help us understand the complexity of 3D IC designs and how it impacts their reliability.
In this episode, you’ll learn about some of the guardrails that increase the reliability of 3D IC devices. You’ll also hear about some of the common challenges an engineer has to solve while designing such devices. Additionally, you’ll get some tips on where to start with 3D IC designs to minimize cost and maximize performance.
What You Will Learn in this Episode:
Improving the reliability of heterogeneous assemblies (01:36)
Solving the heat problem in heterogeneous assemblies (07:46)
The sources of mechanical stress in 3D IC assemblies and how to address them (14:44)
Where to start when designing 3D IC devices (22:07)
Connect with John Ferguson:
LinkedIn
Connect with John McMillan:
LinkedIn
Hosted on Acast. See acast.com/privacy for more information.
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Synopsys
Jun 16, 2010
Envisioning 3D-IC Future
Envisioning 3D-IC Future
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3D InCites Podcast
Nov 16, 2023
AT&S’ Markus Leitgeb and Tony Gueli Talk About Meeting Today’s IC Substrate Challenges
In this episode, Françoise von Trapp talks with AT&S’s Markus Leitgeb and Tony Gueli, about the complex world of IC substrates for advanced microelectronics. The conversation focuses on technical and commercial challenges, and how they can be overcome when you work with the right substrate partners.
You’ll learn about the driving applications for advanced IC substrates, including data storage, data speed, and the automotive industry. You’ll hear about the challenges of keeping up with advanced node technology and the need for reliable interconnects in the assembly industry.
Other topics include the oversupply situation in the substrate industry, the importance of maintaining R&D activities, the lack of substrate manufacturing in the US, and the impact of geopolitics on the supply chain.
*Connect with our speakers on LinkedIn:*
* Markus Leitgeb, R&D Manager
* Tony Gueli, Key Account Director
AT&S
AT&S is a global manufacturer of high-end PCBs and IC substrates for microelectronics applications.
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