Reliability Matters
Dec 10, 2019
Episode 31: A Conversation with Scoop's Phil Stoten
playlist_add
Episode 31: A Conversation with Scoop's Phil Stoten recorded at SMTAI in Chicago. Phil discusses Industry 4.0 and other industry-related topics.
More episodes from Reliability Matters
1 day ago
Episode 116: Supply Chain Musings
On this episode, I speak with Mark Goodwin, COO of Ventec Europe, a supplier of copper clad laminates and prepreg bonding materials for the circuit board fabrication industry about supply chain challenges.
Mark Goodwin's Contact Information:
mark.goodwin@ventec-europe.com
http://www.ventec-group.com
playlist_add
Mar 14, 2023
Episode 115: Making Sense of "Big Data"
You don't have to be in the tech industry you understand importance and value of data. Industries have always collected various sets of data, first manually and, in modern times, automatically. The volume of data has historically been limited to the ability to capture and store it. Recent advances in technology have vastly increased the ability to capture and store data. The industry 4.0 movement has fueled both of desire and requirement to capture data.
We have created a "be careful what you ask for" scenario as we now are capturing data at an unprecedented rate but frequently lack the ability to discern and analyze all of our newly captured data.
My guest today, Luisa Herrmann, Head of Product for Arch Systems, is helping to transform "big data" into useful data. Luisa has 10 years of experience in Product Management and Product Marketing, launching products, building teams, and scaling organizations in the data software space. She was most recently the Head of Product at Cape Privacy, an encrypted machine learning company, and before that she was the Head of Product at expert.ai, an NLP company. She has a degree in Chemical Engineering from the University of Pennsylvania and lives in the Boston area.
Luisa Herrmann may be contacted here:
lherrmann@archsys.io
https://archsys.io/
playlist_add
Feb 21, 2023
Episode 114: The Remarkable Return of the Post-Reflow Cleaning Process
On this show, we’ve discussed many aspects of the Electronics assembly process. We talked about reflow, thermal management, printing, soldering materials, additives, and so much more. What do all these topics have in common? When done correctly, they all contribute to the reliability of circuit assemblies.
Today, we’re going to dive into the subject of cleaning circuit assemblies after reflow. For many assemblers, the cleaning process was replaced by the use of no clean flux technology. Time and technology have eroded the concept of allowing all residues to remain on the assembly. Today, residue caused failures are such a concern, that IPC recently and radically changed the way circuit assemblies are considered to be clean.
My guests today are Sal Sparacino and Eric Camden. Sal is Director of Sales at Zestron Americas, located in Manassas Virginia. Zestron is a manufacturer of cleaning chemicals for the electronics industry. Eric is Lead Investigator for Foresite, an analytical laboratory based in Kokomo Indiana. Eric, is the guy you call when things go wrong. Together with my experience as a cleaning equipment manufacturer, we’ll discuss how cleaning contributes to increased reliability, and we’ll review the reasons cleaning has returned as a mainstream assembly process.
*Guest Contact Info: *
Sal Sparacino
sal.sparacino@zestronusa.com
https://www.zestron.com
Eric Camden
ericc@foresiteinc.com
https://www.foresiteinc.com
playlist_add